RPS Automation - Selective Soldering Solutions  

 
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RPS Automation is one of the world leaders in the sale of Solderability Test Equipment. RPS manufactures dip and look testers, low volume dipping systems, Meniscographs to measure wetting forces, rotary dip testers for PWBs and steam aging equipment. The ANSI J specifications have changed some of the requirements of solderability testing, but RPS equipment is capable of doing all forms of testing whether it be ANSI J or MIL-SPEC 202 method 208.
   

202TL Solderability Tester
Meets ANSI-J-STD002, ANSI-J-STD003, JEDEC JESD22-B102D, MIL-STD-202
Lead free compatible solder pots
3-Axis motion control system control system for programmable speeds, dwells, positions, acceleration, and time
Process parameters including flux, solder emersion and immersion speed, solder, flux and traverse dwell times, number of cycles required and solder temperature are set digitally
A larger model, the 202TL-2™ features 2-solder pots to perform such applications as burning off gold coatings in the first pot, then tinning in the second
Optional vacuum rotary tooling for automated processing of QFP, Flat-paks etc
CE Cabled

ST-2™ and ST-2D™ Steam Aging Systems
Meets ANSI-J-STD002, ANSI-J-STD003, JEDEC JESD22-B102D, MIL-STD-202, IEC-68-2-54
Complete monitoring and control of steam or water temperature
Features include: automatic timing of the test duration, digitally indicator for elapsed time and cycle time, safe steam ventilation, condensation kept away from components and automatic shut down at the end of the pre-programmed cycle
The ST-2D featured 3 individually timed, ESD protected drawers with a unique closure mechanism that reduces steam escapement during drawer removal
The ST-2 and ST-2d are both constructed for durability and are virtually unaffected by de-ionized or distilled water
CE Cabled
   

SS100 Lead Tinning System                       
Features a 2-axis closed loop servo driven motion, on which is mounted an easy to use tool holder.
Located in the base of the system are the options for a variety of solder pots and solder management systems, fluxing strategies, and pre-heating.
The system can be configured in any number of ways including multiple solder & flux baths, cleaning stations, load & drop-off stations and much more.
The controller for the system is a PC with color flat-screen display, keyboard, hard drive, and proprietary Windows XP software. The Windows software platform is easy to learn yet very functional.
Static and Dynamic Solder Pots
Static Models - Suitable For All Basic Tinning Applications, Including Lead Attach
Lead free compatible
Dynamic Models - Evenly Heats Solder with Integral PID Proportional Temperature Control with Dual Display
Constructed for years of trouble-free operation
Optional automatic dross wiping mechanisms, and nitrogen inerting available with most models
 

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