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202TL - Solderability
Tester |
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Applications
- The system is available
in two models; the -1 with an imbedded
fluxer and solder pot, and the -2 with an
imbedded fluxer, and two solder pots. The
dual solder pot capability provides some
interesting opportunities, such as, 1) the
ability to populate the solder pots with
different solder alloys, 2) operate the
solder pots at different solder
temperatures, or 3) use one as a gold
scavenge solder pot and the other as a clean
solder pot.
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Features |
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Description |
- The 202TL “Dip and
Look Tester” is the standard in the
industry with thousands of installed
sites.
- The controller for
the system is a PLC with touch screen
HMI, and stepper-motor motion control.
- The system meets all
domestic and international
specifications for solderability testing
including ANSI-J-STD-002,
ANSI-J-STD-003, IEC, JEDEC and others.
- The system is also
used for lead tinning, dissolution of
metal testing, and thermal shock
testing.
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Both systems feature a PLC
controller with a programmable X and Z, and
touch screen operator interface. These
systems also feature PID Temperature
controls, automatic dross wiper, and
lead-free cable solder pot(s). There are
options for rotary vacuum tooling for
handling QFP, and flat-packs, Nitrogen
inerting, as well as dynamic solder baths.
Because of the enormous range of leaded and
lead-less devices tooling is no longer
furnished with the system. A tooling catalog
is available on request, and RPS will also
design custom tooling to support your unique
needs. |
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Specifications* |
Controller
The controller for the system is a PLC
with touch panel operator interface. You
can create, teach, and store an
exceptionally large number of programs
in the PLC. The motion commands can then
recall these points and move to any one
of them. The motors can be put into a
jog mode for the purpose of checking and
teaching points. The system can
typically be programmed in less than 15
minutes. Controls include speeds,
accelerations, position, time,
temperature, I/O for nitrogen, etc. |
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SPECIFICATIONS
Performance
Configuration:
-1 POT / Two Stations / Solder pot /
Flux Bath
-2 POTS / Three Stations / Solder Pot
(2-each) / Flux Bath
Motion
Z-Axis Speed: 0-6 inches/sec +/- .002”
(0-150mm +/- .05mm)
X-Axis Speed: 0-10 inches/sec +/- .002”
(0-250mm +/- .05mm)
Immersion Depth: Programmable in .001
steps (.025mm)
Immersion Time: Programmable in
milliseconds
Solder Pot
Temperature Controller: PID
Temperature range: 0-325°C +/- 2°C
Solder Pot Capacity: 15.5 lbs (7-kg)
Solder Pot: lead-free capable
Dimensions: 6x4x2.5” deep (150mm x 100mm
x 62.5mm)
Flux
Polypropylene flux container
Pre-heat
Dwell over solder pot for programmed
time and temperature
Controller
PLC with touch-screen
Physical & Facilities
Dimensions: 36L x 18D x 16H” (900mm x
450mm x 400mm)
Weight: -1 100-Lbs (45.5kg), -2 130-Lbs
(59kg)
Power: 110VAC
Air: Optional
N2: Optional
Note: Air and Nitrogen may be required
based on the selected options |
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*specifications subject to change
without notice |
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