|
Touch-screen HMI |
|
PLC controller stores
large number of programs |
|
Programmable
immersion/emersion speeds |
|
Programmable positions |
|
Programmable times |
|
Lead-free capable solder
pot(s) |
|
PID Temperature controls |
|
202TL-2 features two
solder pots |
|
Dedicate to different
solder alloys |
|
Dedicate to gold scavenge
solder pot |
|
Operate at different
process temperatures |
|
Integrated flux tank |
|
|
Both systems feature a PLC
controlled programmable X and Z axis with a
touch screen HMI operator interface.
Features PID temperature controls, automatic
dross wiper, and lead-free capable solder
pot(s). Options for rotary vacuum tooling
for handling QFP, and flat-packs, Nitrogen
inerting, as well as dynamic solder baths.
Custom tooling required because of the
enormous range of leaded and lead-free
devices. A tooling catalog is available on
request, and RPS will also design custom
tooling to support your unique needs. |