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SS100A Mass Dip Selective Soldering System

 

The SS100A is designed specifically for high-speed selective soldering of through-hole and odd form components into mixed technology PCBs, using site specific solder nozzles and a mass dip solder process, wherein all solder points are soldered simultaneously for maximum productivity. The SS100A has a 2 axis (X, Z) solder station and 2 axis (X, Y) flux station. The exceptional speed and durability (as fast as 10 seconds per PCB on a 24x7 operation) is possible through utilization of dynamic 12" x 12" solder pot, servo motion control precision, and custom mass dip nozzles. An optional tilt-axis provides peel-back to reduce bridging of fine pitch connector pins. A large re-circulating solder reservoir is compatible with lead or lead-free processing.  

SS100A Mass Dip Selective Soldering System

     
     

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