The Odyssey Lead Tinning System is a high volume lead tinning system for electronic component tinning and re-tinning applications. The Odyssey can strip, flux, condition, tin or re-tin virtually any component. Single or multiple components are loaded via standard and custom component tool holders inserted into a universal socket. The components then travel via precision direct drive ball screws along X and Z axes.

Options include pre-heat, rinse, dry and secondary flux stations, as well as single or multiple rotation tooling (for Flatpak / QFPs) and standard and custom component tooling.

The standard configuration includes two solder stations, the first station is a scavenge pot. The middle flux station applies flux prior to the third process station where a nitrogen inerted dynamic laminar solder presentation with a dip nozzle enables precise application of solder to the component leads.

All stations offer a large 5 x 8” (40” square inch) process area. The scavenge solder pot features an automatic dross wiper prior to process. An integrated computer, and program and process management software are standard.

The solder pots are constructed of a treated non-contaminating alloy that is durable and lead-free compatible. The scavenge pot static solder presentation is flat and non-turbulent. A dross wiper precedes each dip process. The tinning dynamic solder pot is configured with nitrogen inertion to provide a superior laminar flow and reduce icicles and bridging. All solder pots are lead-free ready and come with a lifetime warranty.

All RPS Systems are made in the USA and feature a full one year warranty and lifetime solder pot warranty.