The Hentec RPS Pulsar and Photon are proven industry platforms for the Dip & Look Solderability Test and the Steam Aging Test in accordance with IPC and MIL-spec industry standards.
“Dip & Look Test”— The Pulsar provides precise handling of electronic components for the automated process of a flux and solder dip of the component terminations. After the dip process, the operator inspects the terminations (i.e., “look”) for the adequate presence of solder. If adequate, the component is validated for authenticity and solderability with the selected solder alloy.
“Artificial Aging” Test— The Photon provides additional testing capability by artificially aging components prior to the “dip & look test”. The artificial aging is produced by 8-hours of exposure to precision controlled temperature and steam. The J Standard requires steam aging as a component of the solderability test process. This industry specified steam process replicates the impact of 12+ months of storage. After the aging process, the components are brought to the Prelude for solderability testing and, if successful, certification for long-term storage.
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Solderability testing pertains to the process of evaluating the solderability of leads, terminations and wires on an electronic component. The solderability of a lead, termination or surface is defined by its solder wetting characteristics. There are several different ways that solderability testing can be performed, RPS specializes in the “Dip and Look” method.
Steam aging is an automated process to artificial age electronic components and circuit boards, including high density, discrete components. The steam aging process is designed to test components to determine if they meet the military and commercial Hi-Rel specifications MIL-STD 202, Method 208.
RPS systems meet all current industry standards for solderability testing equipment
Standards compliance in every solderability testing machine includes:
Standards compliance in steam aging machines includes:
The Pulsar is a proven industry platform that enables the Dip & Look Solderability Test in accordance with the Mil-STD-202, Method 208.