RPS - Be Selective
RPS - Be Selective
RPS - Be Selective

2017 News

  • Hentec/RPS Introduces Next Generation Selective Solder Machines +

    Hentec/RPS Introduces Next Generation Selective Soldering Systems Spokane Valley, Washington,— Hentec Industries, Inc. (formerly RPS Automation LLC), a manufacturer of Read More
  • RPS Partners With SMT Capital +

    FOR IMMEDIATE RELEASE   17-May-2017   Hentec/RPS Joins SMT Capital for Representation in Ohio, Indiana, and W. Pennsylvania A New Read More
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Odyssey / Odyssey LX - High Volume Lead Tinning Machines

RPS Odyssey

A high volume lead tinning machine for electronic component tinning and re-tinning applications, the Odyssey can strip, flux, condition, tin, or re-tin virtually any component. The Odyssey is a made-to-order system consisting of 6 configurable 5 x 8” stations. Options include pre-heat, rinse, dry, and secondary flux. Standard and Custom tooling are available for the Odyssey, as well as single and multiple rotation tooling (for Flatpack and QFP’s).

Odyssey LX Features:

  • High Volume, High Mix Capacity
  • Unlimited Programs
  • Auto Load/Unload
  • Mil Spec Compliant
  • Interpolated X and Z Rotation Motion Control
  • High Precision Ball Screw Motion
  • Wide Process Control:
    solder temp, emersion depth, travel speed, dwell time, simultaneous moves

STANDARD CONFIGURATION FOR THE ODYSSEY / LX

The standard lead tinning system configuration includes manual load of component tooling to the universal socket, which resides on the system X and Z gantry. Three (3) stations are standard: a scavenge pot with static molten solder, a dynamic recirculating new alloy dip station (DSP), and a dynamic recirculating flux station. The DSP includes nitrogen inertion and an automatic dross wiper. An integrated computer, program and process management software, a one-year system warranty and a lifetime solder pot warranty are standard.

Model

Process
Area

Process
Method

Robotic
Motion

Solder Pot
#1 Scavenge

Solder Pot
#2 Tin

Max
Stations

Odyssey

5 x 8"
125 x 200 mm

Component Motion

Direct Drive
Ball Screw

Static

Dynamic

8

Odyssey LX

5 x 8"
125 x 200 mm

Component Motion

Direct Drive
Ball Screw

Static

Dynamic

5

 

HIGH VOLUME LEAD TINNING SYSTEM APPLICATIONS

The Odyssey can be configured with 3 additional stations, which can include auto load/unload, rinse, 2nd flux, preheat, or dry stations (the preheat and dry stations can be combined into one station). The extensive configuration capabilities of an Odyssey enable durable and lustrous solder coating of a wide array of common and exotic through-hole and SMT components including QFP, QFN, SOT, axial, discrete, BGA, PLCC, CLCC, DIP, SIP, capacitor, resistor, and inductor types. Rotation, tilt and custom dip nozzles can be deployed to handle multi-sided and fine pitch applications.

FEATURES & BENEFITS of HIGH VOLUME LEAD TINNING

  • Precise Process Repeatability
  • Tin Virtually Any Component Type
  • High Precision ± .002"
  • Unlimited Programs
  • Automatic Dross Wiper
  • Interpolated X, Z, Rotation Motion
  • Nitrogen Inertion
  • Control All Process Parameters: solder temp, emersion depth, travel speed, dwell time, simultaneous moves

SOLDER MANAGEMENT

The solder pots are constructed of a non-contaminating alloy that is extremely durable, stable and lead-free compatible. (RPS solder pots are backed by a lifetime warranty). The large solder capacity provides ample solder mass for large format applications with no thermal loss. The solder is presented as a flat and non-turbulent solder surface with minimal dross production. The dynamic solder pot is configured with nitrogen inertion to provide a superior laminar flow and to enable processing of QFP, LCC, fine pitch and short lead length components.

STANDARDS COMPLIANCE

  • GEIA-STD-0006 For Solder Dip to Replace Finish
  • ANSI-J-STD-002 Method A, B, C, & D (w/wave)
  • IEC-68-2-20 Test TA, Para 4.9, & Test TB,
  • IEC-68-2-58 Test TD
  • JESD22-B102D Method 1
  • JESD22A111 Method 5.6.2
  • JISZ-3198-4 Method B
  • Mil-STD-202 Method 208
  • Mil-STD-883

EXTENSIVE CONTROL CAPABILITIES

The operator can program using a laptop computer. This allows for network access, unlimited program storage, concurrent axis control (e.g., interpolated multi-axis simultaneous moves), and a simple user interface. The operator has total control to set all process parameters, including immersion depths, dwell times, insertion and extraction speed and acceleration. A trained operator can program a solution in less than 15 minutes. I/O and new move commands can be issued while in motion. Dynamic flux is standard for flux types prone to separation.

OPTIONS

Optional stations include auto load/unload, pre-heat, rinse, dry and secondary flux stations. In addition, single or multiple part rotation tooling with unlimited degrees of simultaneous controlled rotation and extraction angles can be added to the system (up to 4 QFP’s can be rotated simultaneously). Wave nozzles are available (on the DSP) for applications such as SMT components and other components better suited for drag processing instead of the traditional dip processing.

Lead Tinning Equipment Specifications

Control

A PLC & servo motor drive system manage the Odyssey. Easy to write G-code programs are readily input or modified at the laptop display or off-line on a PC. The abundant I/O controls auxiliary functions such as the optional rotary effector, dynamic flux vessel, auto loading and more. Unlimited programs can be stored. Component handling tools must be acquired to handle customer-specific components. RPS offers standard and custom component tooling.

Operation

  • Standard Stations 1 Static Solder Station | Scavenge 1 Dynamic Solder Station | New Tin 1 Recirculating Flux Station 3 Open Stations
  • Operation Windows 7 PC (included)
  • Accuracy X | Z Axes± .002" | 0.05mm
  • Programmability Unlimited program storage capacity
  • Immersion Depth Programmable ± .002” | 0.05mm
  • Speed X Axis Programmable 1-88 mm/sec | 3.5”/sec
  • Speed Z Axis Programmable 1-25 mm/sec | 1”/sec
  • Immersion Time Programmable in milliseconds
  • Interpolated Motion Simultaneous X, Z and Rotation*

Solder Management

  • Temp Control PID proportioning (0-325°C) ± 2°C
  • Solder Pot Electro Polished Stainless Steel
  • Process Range (W x L x D)5 x 8 x 4” | 125 x 200 x 100” mm
  • Capacity Static 40 Lbs | 18 kgs Dynamic 300 Lbs | 140 kgs
  • Solder Height Alert Standard
  • Static Dross Wiper Standard
  • Lead Free Ready Standard
  • HMP Capable Option

Flux Station

  • Range 5 x 8 x 4” | 125 x 200 x 100 mm
  • Flux Dip Station Standard | Recirculating Pump

ADDITIONAL STATIONS

  • Rinse Station Option | Recirculating Optional
  • 2nd Flux Station Option
  • PreHeat Station Option | IR 0 - 500 C (± 2 C)| + 20 amp
  • Air Dry Station Option

Major Options (also denoted by * above)

  • Controlled Rotary Motion

  • 2nd Flux Station

  • Dry Station

  • Wave Solder Nozzle

  • Wash/Rinse Bath Station

  • Auto Load/Unload


Physical

Electrical 220VAC | 1Ø 5 Wire | 50-60hz | 40amp

Weight 900 lbs | 410 kgs

Ground < 2 Ω Resistance | < 2 mV RMS

Compliance UL and CE

Air 80 PSI

Exhaust 20 SCFH (ft3) | 0.56 CMH (m3)

Odyssey Dimensions 74 x 44 x 55

(W x L x D) 1880 x 1118 x 1397 mm

Freight 84 x 36 x 48” | 1,100 lbs | 550 kgs

Nitrogen <50 PPM @ 150 CFH

 

Odyssey LX Dimensions 74 x 44 x 55

(W x L x D) 1880 x 1118 x 1397 mm

Freight 84 x 36 x 48” | 1,100 lbs | 550 kgs

 

Interested?  We're here to answer your questions

Check out This video to see how the Odyssey runs.
For more information, give us a call @ 509.89101680 x200 or send a detailed message to This email address is being protected from spambots. You need JavaScript enabled to view it.