RPS - Be Selective
RPS - Be Selective
RPS - Be Selective

2017 News

  • Hentec/RPS Introduces Next Generation Selective Solder Machines +

    Hentec/RPS Introduces Next Generation Selective Soldering Systems Spokane Valley, Washington,— Hentec Industries, Inc. (formerly RPS Automation LLC), a manufacturer of Read More
  • RPS Partners With SMT Capital +

    FOR IMMEDIATE RELEASE   17-May-2017   Hentec/RPS Joins SMT Capital for Representation in Ohio, Indiana, and W. Pennsylvania A New Read More
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Lead Tinning Machines

RPS was an early pioneer in small, mid and high volume lead tinning equipment. All RPS lead tinning machines are designed for universal component tinning, and can be configured for lead frame attach, coil lead attach, component rework, and component solder testing. RPS systems can handle standard connectors and odd-form devices and custom assemblies.

Lead Tinning Machine Choices For Sale

Since 2010, RPS Automation has introduced next generation lead tinning machine systems that serve all industry segments: the Odyssey for high volume applications, the Anthem for budget conscious, mid-volume applications and the Prelude for small lot production.

Front Small 2  Odyssey 1750 small 
Odyssey 925 Odyssey 1325 / Odyssey 1750
SYSTEM MOTION RANGE STATIONS PURPOSE
Odyssey 925 X/Z Lead Screw Stepper Motion 4” x 4” DSP Area 3 Standard w/DSP 4 Capable Mid Range Production / Economy
Odyssey 1325/Odyssey 1750 X / Z Lead Screw Optional Auto Load Servo Motion 5” x 8” DSP Area 4 Standard w/DSP 5 Capable High Volume / Small Footprint

What is Lead Tinning?

Lead tinning describes the tinning or solder coating of SMT, through hole and odd form electronic components. A broad list of lead tinning services can include solder coating, lead attach, component remove, replace and rework, solderability testing, resistance to soldering heat testing, and resistance to dissolution of metallization testing.

lead tinning lead tinning machine spokane

The lead tinning process consists of a manual or automated process of applying an alloy to a new component or stripping the old alloy or substance (gold, lead or lead free alloys) from a component and replacing it with the new alloy. Stations for scavenge, flux, wash, dry, load and unload are common. Configurations for single component, multiple component, angled inertion, directed solder flow, as well as static and dynamic chemistry treatment (e.g., dynamic flux bath, dynamic solder bath) are also common. 

Market Trends

Increasingly, component suppliers, distributors and customers are demanding automated processes. Components that require lead tinning can be characterized as expensive, difficult to obtain, and in use in complex hi-rel applications such as medical, military and aerospace applications.

Manual processing of a tin dipping process is prone to damage, inconsistency, and error. Most standards today (J and MIL) require an automated process for tinning a component.

RPS automated systems deliver precision, repeatability and defect free processing that modern manufacturers demand.