RPS - Be Selective
RPS - Be Selective
RPS - Be Selective

2018 News

  • Financing For Selective Soldering Machines From RPS Automation +

    Benefits of Financing For Selective Soldering Machines In selective soldering machines is substantial, as you are likely well aware. As Read More
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    Newman Lake, Washington, April 16, 2018 — Hentec Industries, Inc. (formerly RPS Automation), a leading US manufacturer of selective solder, lead Read More
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Odyssey / Odyssey LX - High Volume Lead Tinning Machines

RPS Odyssey

A high volume lead tinning machine for electronic component tinning and re-tinning applications, the Odyssey can strip, flux, condition, tin, or re-tin virtually any component. The Odyssey is a made-to-order system consisting of 6 configurable 5 x 8” stations. Options include pre-heat, rinse, dry, and secondary flux. Standard and Custom tooling are available for the Odyssey, as well as single and multiple rotation tooling (for Flatpack and QFP’s).

Odyssey LX Features:

  • High Volume, High Mix Capacity
  • Unlimited Programs
  • Auto Load/Unload
  • Mil Spec Compliant
  • Interpolated X and Z Rotation Motion Control
  • High Precision Ball Screw Motion
  • Wide Process Control:
    solder temp, emersion depth, travel speed, dwell time, simultaneous moves

STANDARD CONFIGURATION FOR THE ODYSSEY / LX

The standard lead tinning system configuration includes manual load of component tooling to the universal socket, which resides on the system X and Z gantry. Three (3) stations are standard: a scavenge pot with static molten solder, a dynamic recirculating new alloy dip station (DSP), and a dynamic recirculating flux station. The DSP includes nitrogen inertion and an automatic dross wiper. An integrated computer, program and process management software, a one-year system warranty and a lifetime solder pot warranty are standard.

Model

Process
Area

Process
Method

Robotic
Motion

Solder Pot
#1 Scavenge

Solder Pot
#2 Tin

Max
Stations

Odyssey

5 x 8"
125 x 200 mm

Component Motion

Direct Drive
Ball Screw

Static

Dynamic

8

Odyssey LX

5 x 8"
125 x 200 mm

Component Motion

Direct Drive
Ball Screw

Static

Dynamic

5

 

HIGH VOLUME LEAD TINNING SYSTEM APPLICATIONS

The Odyssey can be configured with 3 additional stations, which can include auto load/unload, rinse, 2nd flux, preheat, or dry stations (the preheat and dry stations can be combined into one station). The extensive configuration capabilities of an Odyssey enable durable and lustrous solder coating of a wide array of common and exotic through-hole and SMT components including QFP, QFN, SOT, axial, discrete, BGA, PLCC, CLCC, DIP, SIP, capacitor, resistor, and inductor types. Rotation, tilt and custom dip nozzles can be deployed to handle multi-sided and fine pitch applications.

FEATURES & BENEFITS of HIGH VOLUME LEAD TINNING

  • Precise Process Repeatability
  • Tin Virtually Any Component Type
  • High Precision ± .002"
  • Unlimited Programs
  • Automatic Dross Wiper
  • Interpolated X, Z, Rotation Motion
  • Nitrogen Inertion
  • Control All Process Parameters: solder temp, emersion depth, travel speed, dwell time, simultaneous moves

SOLDER MANAGEMENT

The solder pots are constructed of a non-contaminating alloy that is extremely durable, stable and lead-free compatible. (RPS solder pots are backed by a lifetime warranty). The large solder capacity provides ample solder mass for large format applications with no thermal loss. The solder is presented as a flat and non-turbulent solder surface with minimal dross production. The dynamic solder pot is configured with nitrogen inertion to provide a superior laminar flow and to enable processing of QFP, LCC, fine pitch and short lead length components.

STANDARDS COMPLIANCE

  • GEIA-STD-0006 For Solder Dip to Replace Finish
  • ANSI-J-STD-002 Method A, B, C, & D (w/wave)
  • IEC-68-2-20 Test TA, Para 4.9, & Test TB,
  • IEC-68-2-58 Test TD
  • JESD22-B102D Method 1
  • JESD22A111 Method 5.6.2
  • JISZ-3198-4 Method B
  • Mil-STD-202 Method 208
  • Mil-STD-883

EXTENSIVE CONTROL CAPABILITIES

The operator can program using a laptop computer. This allows for network access, unlimited program storage, concurrent axis control (e.g., interpolated multi-axis simultaneous moves), and a simple user interface. The operator has total control to set all process parameters, including immersion depths, dwell times, insertion and extraction speed and acceleration. A trained operator can program a solution in less than 15 minutes. I/O and new move commands can be issued while in motion. Dynamic flux is standard for flux types prone to separation.

OPTIONS

Optional stations include auto load/unload, pre-heat, rinse, dry and secondary flux stations. In addition, single or multiple part rotation tooling with unlimited degrees of simultaneous controlled rotation and extraction angles can be added to the system (up to 4 QFP’s can be rotated simultaneously). Wave nozzles are available (on the DSP) for applications such as SMT components and other components better suited for drag processing instead of the traditional dip processing.

Lead Tinning Equipment Specifications

Control

A PLC & servo motor drive system manage the Odyssey. Easy to write G-code programs are readily input or modified at the laptop display or off-line on a PC. The abundant I/O controls auxiliary functions such as the optional rotary effector, dynamic flux vessel, auto loading and more. Unlimited programs can be stored. Component handling tools must be acquired to handle customer-specific components. RPS offers standard and custom component tooling.

Operation

  • Standard Stations 1 Static Solder Station | Scavenge 1 Dynamic Solder Station | New Tin 1 Recirculating Flux Station 3 Open Stations
  • Operation Windows 7 PC (included)
  • Accuracy X | Z Axes± .002" | 0.05mm
  • Programmability Unlimited program storage capacity
  • Immersion Depth Programmable ± .002” | 0.05mm
  • Speed X Axis Programmable 1-88 mm/sec | 3.5”/sec
  • Speed Z Axis Programmable 1-25 mm/sec | 1”/sec
  • Immersion Time Programmable in milliseconds
  • Interpolated Motion Simultaneous X, Z and Rotation*

Solder Management

  • Temp Control PID proportioning (0-325°C) ± 2°C
  • Solder Pot Electro Polished Stainless Steel
  • Process Range (W x L x D)5 x 8 x 4” | 125 x 200 x 100” mm
  • Capacity Static 40 Lbs | 18 kgs Dynamic 300 Lbs | 140 kgs
  • Solder Height Alert Standard
  • Static Dross Wiper Standard
  • Lead Free Ready Standard
  • HMP Capable Option

Flux Station

  • Range 5 x 8 x 4” | 125 x 200 x 100 mm
  • Flux Dip Station Standard | Recirculating Pump

ADDITIONAL STATIONS

  • Rinse Station Option | Recirculating Optional
  • 2nd Flux Station Option
  • PreHeat Station Option | IR 0 - 500 C (± 2 C)| + 20 amp
  • Air Dry Station Option

Major Options (also denoted by * above)

  • Controlled Rotary Motion

  • 2nd Flux Station

  • Dry Station

  • Wave Solder Nozzle

  • Wash/Rinse Bath Station

  • Auto Load/Unload


Physical

Electrical 220VAC | 1Ø 5 Wire | 50-60hz | 40amp

Weight 900 lbs | 410 kgs

Ground < 2 Ω Resistance | < 2 mV RMS

Compliance UL and CE

Air 80 PSI

Exhaust 20 SCFH (ft3) | 0.56 CMH (m3)

Odyssey Dimensions 74 x 44 x 55

(W x L x D) 1880 x 1118 x 1397 mm

Freight 84 x 36 x 48” | 1,100 lbs | 550 kgs

Nitrogen <50 PPM @ 150 CFH

 

Odyssey LX Dimensions 74 x 44 x 55

(W x L x D) 1880 x 1118 x 1397 mm

Freight 84 x 36 x 48” | 1,100 lbs | 550 kgs

 

Interested?  We're here to answer your questions

Check out This video to see how the Odyssey runs.
For more information, give us a call @ 509.89101680 x200 or send a detailed message to This email address is being protected from spambots. You need JavaScript enabled to view it.   

Odyssey 925 Lead Tinning Machine

Odyssey 925

The Odyssey 925 is a mid-range lead tinning machine for electronic component tinning and re-tinning applications. It is capable of production volume processing, and efficiently priced and sized. The Odyssey 925 lead tinning system can be configured with 4 possible stations, including a 35-lb solder pot for scavenge, a flux station, a preheat station and a dynamic solder pot for high precision tinning application. Optional rotation is available to handle QFPs and other multi-sided components.

Process
Area

Process
Method

Robotic
Motion

Active
Solder Pots

Max
Stations

Dynamic
Solder Pot

Component
Handling

4 x 4"
100 x 100 mm
Component Motion Direct Drive
Lead Screw
(1) Static
(1) Inerted Dynamic
4 New Tin Station Standard & Custom

 

FLEXIBLE LEAD TINNING SYSTEM APPLICATIONS

The Odyssey 925 Lead Tinning System can apply durable and lustrous solder coating to through-hole and SMT terminations. Applications include lead tinning, solder coating, lead attach, component remove, replace and rework, solderability testing, resistance to soldering heat testing, and resistance to dissolution of metallization testing. A properly configured system can handle common and exotic components and connectors, including, but not limited to: QFP, flatpack, axial, discrete, BGA, PLCC, CLCC, DIP, SIP, capacitor, resistor and inductor components.

Odyssey 925 MACHINE FEATURES

  • Unlimited Programs | Integrated Laptop for Programming and Operation
  • High Precision Lead Screw Motion | Repeatability ± .002"
  • Interpolated X, Z, Rotation Motion for Superior Solder Performance
  • Wide Process Control: solder temp, emersion depth, travel speed, dwell time, simultaneous moves
  • Agitation Motion for Effective Alloy Removal
  • Automated Rotation for QFP Processing (option)

BENEFITS OF THE ODYSSEY 925

  • Easy Set-up & Immediate Results
  • Precise Process Control & Repeatability
  • Superior Results vs Hand Tinning
  • Tin Virtually Unlimited Component Types
  • Change Nozzles for Dip and Wave Tinning

SOLDER MANAGEMENT

The 35 lb-capacity solder pot is constructed of a non-contaminating alloy that is durable, stable and lead-free compatible. The scavenge station is a static (non-flowing) solder mass for the removal of old alloys. The Dynamic Solder Pot Station pumps solder through a nitrogen inertion chamber. The smooth action impeller system combined with the N2 blanket, produces a smooth laminar flow of solder for exceptional tinning of all components, especially QFP, LCC, fine pitch and short lead length components. 

EXTENSIVE CONTROL CAPABILITIES

Program using a laptop computer. network access, nearly unlimited program storage, concurrent axis control, and a simple user interface are standard. Operators select commands to build program files. Immersion speed, dwell, and position are independently set for each station. Link up to 4-axes to produce linear interpolated motion. Easily check input states, toggle output states, and configure the names of each I/O point. A trained operator can program a solution in less than 15 minutes. 

STANDARDS COMPLIANCE

  • GEIA-STD-0006 For Solder Dip to Replace Finish
  • ANSI-J-STD-002 Method A, B, C, & D (w/wave)
  • IEC-68-2-20 Test TA, Para 4.9, & Test TB,
  • IEC-68-2-58 Test TD
  • JESD22-B102D Method 1
  • JESD22A111 Method 5.6.2
  • JISZ-3198-4 Method B
  • Mil-STD-202 Method 208 & Mil-STD-883

SAFETY | EASE OF MAINTENANCE

Integrated safety features stop all motion when the load window and access hood are opened. For easy maintenance and solder pot changeover, a sliding platform extends the solder pots clear of the inner vessel. This allows the operator to easily and safely access the pot and pump for routine maintenance. 

Odyssey 925 Lead Tinning Equipment Specifications

Control

A stepping motor drive system manages the Odyssey 925. Easy to write programs are readily input or modified at the laptop display or off-line on a PC. The abundant I/O controls auxiliary functions such as the optional rotary vacuum end effectors and nitrogen inerting system. Unlimited average length programs can be stored in the memory. Safety hood with interlock. The controller features end-user friendly programming, editing and manual jog capabilities. Optional upgrade features are denoted by an asterisk (*).

Operation

Configuration 4 Station Ready

Standard Stations 2 Static Solder Stations | Flux Station

Operation Windows Laptop PC

Programmability Unlimited program storage capacity

Accuracy X | Z Axes± 0.05 mm | 0.002”

Travel Z Axis 100 mm | 4.0”

Speed X Axis Programmable 1-88 mm/sec | 3.5”/sec

Speed Z Axis Programmable 1-25 mm/sec | 1”/sec

Immersion Time Programmable in milliseconds

Interpolated Motion Simultaneous X, Z and Rotation*

Solder Management

Temp Control PID proportioning (0-325°C) ± 2°C

Solder Pot Electro Polished Stainless Steel

Static Range (W x L x D)125 x 200 x 100 mm | 5 x 8 x 4”

Dynamic Range 64 x 115 x 64 mm | 4 x 4 x 2.5”

Capacity 35 Lbs | 15 kgs

Lead Free Ready Standard

Flux Station

Static Range 4 x 4 x 2.5” | 100 x 100 x 63 mm

PreHeat Station

3rd Station PreHeat* Option | Solder Pot Replacement

Dimensions (W x L) 4 x 4”

Type | Range IR | 0 - 500 C (± 2 C)

Major Options(also may be listed above with *)

  • Rotary QFP Motion
  • 3rd Station Pre Heat
  • 2nd Dynamic Solder Pot
  • Dip Solder Nozzle
  • 4th Station 2nd Flux
  • Custom Component Tools
  • Wave Solder Nozzle

 

  • Standard Component Tools

Physical

Electrical 220 VAC | 1Ø 3 Wire | 50-60 Hz | 20 amp

Weight 225 lbs | 102 kgs

Ground < 2 Ω Resistance | < 2 mV RMS

Compliance UL and CE

Air 80 PSI

Exhaust 20 SCFH (ft3) | 0.56 CMH (m3)

Dimensions 50 x 25 x 19.5”

(W x L x D) 1270 x 635 x 495 mm

Nitrogen <100 PPM @ 50 CFH (option)

Interested? We're here to answer your questions

For more information, give us a call @ 509.89101680 x253 or send a detailed message to This email address is being protected from spambots. You need JavaScript enabled to view it.  

Lead Tinning Machines

RPS was an early pioneer in small, mid and high volume lead tinning equipment. All RPS lead tinning machines are designed for universal component tinning, and can be configured for lead frame attach, coil lead attach, component rework, and component solder testing. RPS systems can handle standard connectors and odd-form devices and custom assemblies.

Lead Tinning Machine Choices For Sale

Since 2010, RPS Automation has introduced next generation lead tinning machine systems that serve all industry segments: the Odyssey for high volume applications, the Anthem for budget conscious, mid-volume applications and the Prelude for small lot production.

lead tinning machine odyssey 925  Odyssey 1750 best lead tinning machine 
Odyssey 925 Odyssey 1325 / Odyssey 1750
SYSTEM MOTION RANGE STATIONS PURPOSE
Odyssey 925 X/Z Lead Screw Stepper Motion 4” x 4” DSP Area 3 Standard w/DSP 4 Capable Mid Range Production / Economy
Odyssey 1325/Odyssey 1750 X / Z Lead Screw Optional Auto Load Servo Motion 5” x 8” DSP Area 4 Standard w/DSP 5 Capable High Volume / Small Footprint

What is Lead Tinning?

Lead tinning describes the tinning or solder coating of SMT, through hole and odd form electronic components. A broad list of lead tinning services can include solder coating, lead attach, component remove, replace and rework, solderability testing, resistance to soldering heat testing, and resistance to dissolution of metallization testing.

lead tinning lead tinning machine spokane running a lead tinning machine

The lead tinning process consists of a manual or automated process of applying an alloy to a new component or stripping the old alloy or substance (gold, lead or lead free alloys) from a component and replacing it with the new alloy. Stations for scavenge, flux, wash, dry, load and unload are common. Configurations for single component, multiple component, angled inertion, directed solder flow, as well as static and dynamic chemistry treatment (e.g., dynamic flux bath, dynamic solder bath) are also common. 

Lead Tinning Market Trends

lead tinning machine options

Increasingly, component suppliers, distributors and customers are demanding automated processes. Components that require lead tinning can be characterized as expensive, difficult to obtain, and in use in complex hi-rel applications such as medical, military and aerospace applications.

Manual processing of a tin dipping process is prone to damage, inconsistency, and error. Most standards today (J and MIL) require an automated process for tinning a component.

RPS automated systems deliver precision, repeatability and defect free processing that modern manufacturers demand.