RPS Automation designs and manufactures a complete line of high precision selective soldering, lead tinning and component test and steam aging equipment for electronics and circuit board manufacturing and assembly. RPS has over 20 years of automated soldering experience and more than 480 installations. Customers range from aerospace, military, communications and medical device manufacturers to industrial OEM, auto and contract manufacturers big and small. All systems are built in the USA and feature precision robotics... Read more>
Selective soldering uses traveling flux and miniwave technology to apply a precise amount of flux and solder to select through hole components terminations on a printed circuit board (PCB). RPS uses several types of XYZ axis configurations to articulate the soldering miniwave beneath the circuit board.
Lead tinning describes the tinning or solder coating of SMT, throughhole and odd form electronic components. A broad list of lead tinning applications can include solder coating, lead attach, solderability testing, and resistance to dissolution of metallization testing.
Solderability testing pertains to the process of evaluating the solderability of leads, terminations and wires on an electronic component. The solderability of a lead, termination or surface is defined by its solder wetting characteristics.