What's New

  • Date : Jul, 17, 2007
     RPS Acquired by Investor Group, Recruits Expanded Executive Team Read More
    Date : Mar, 31, 2008
     RPS Announces Strong Customer Growth Read More
  • Date : Apr, 01, 2008
     RPS Expands Distribution into Europe, Asia, and Mexico Read More
    Date : Apr, 02, 2008
     RPS R&D Yields New Innovations and Products Read More
  • Date : Sep, 08, 2008
     RPS Releases CamConductor 2.5 Read More
    Date : Sep, 16, 2008
     RPS to be Showcased in EASi Line at ATE Show Read More
  • Date : Oct, 08, 2008
     RPS Introduces Rhythm EX Selective Soldering System Read More
    Date : Mar, 06, 2009
     Selective Soldering System at US Navy Center of Excellence Read More
  • Date : Mar, 12, 2009
     RPS Chooses Parker Domnick Hunter for Nitrogen Generation Read More
    Date : Mar, 24, 2010
     ROS Introduces New Military Compliant Lead Tinning System Read More
  • Date : Apr, 02, 2010
     New 3D Fiducial Vision Inspection Read More
    Date : Feb, 01, 2013
     RPS Introduces Budge-Friendly Economy Line with FRX Read More

About RPS

RPS Automation designs and manufactures a complete line of high precision selective soldering, lead tinning and component test and steam aging equipment for electronics and circuit board manufacturing and assembly. RPS has over 20 years of automated soldering experience and more than 480 installations. Customers range from aerospace, military, communications and medical device manufacturers to industrial OEM, auto and contract manufacturers big and small. All systems are built in the USA and feature precision robotics... Read more.

Product Video

Our Products

Product

SELECTIVE SOLDERING SYSTEMS

Selective soldering uses traveling flux and miniwave technology to apply a precise amount of flux and solder to select through hole components terminations on a printed circuit board (PCB). RPS uses several types of XYZ axis configurations to articulate the soldering miniwave beneath the circuit board.

Product

LEAD TINNING

Lead tinning describes the tinning or solder coating of SMT, throughhole and odd form electronic components. A broad list of lead tinning applications can include solder coating, lead attach, solderability testing, and resistance to dissolution of metallization testing.

Product

SOLDERABILITY TEST SYSTEMS

Solderability testing pertains to the process of evaluating the solderability of leads, terminations and wires on an electronic component. The solderability of a lead, termination or surface is defined by its solder wetting characteristics.